AGF-ACU Copper Foil Composite Aerogel Insulation Film

AGF-ACU is an ultra-thin composite of a 20, 30, or 50 μm copper foil with a nanoporous aerogel coating, in total thicknesses of 100-300 μm (standard 100±10, 200±20, 300±20 μm; customizable 50-400 μm). The copper layer spreads localized heat in-plane with a thermal conductivity above 380 W/(m·K), while the aerogel coating blocks vertical heat transfer at 0.022-0.026 W/(m·K). This combination delivers dual-sided heat management: lateral spreading on the copper face, through-plane insulation on the aerogel face. The copper also provides EMI shielding above 60 dB across 100 MHz-1 GHz.

The manufacturer positions AGF-ACU for power devices, LED modules, and high-density 3C electronics, where heat must be kept away from sensitive zones while structural integrity is maintained. Listed applications include wearable devices, smartphones, laptops, tablets, OLED displays, smart TVs, digital cameras, and consumer electronics, as well as precision equipment in high-end manufacturing that needs both electronic thermal insulation and EMI protection. The puncture-resistant copper core and nano-engineered aerogel layer are built for long-term reliability with no delamination and no dusting, suiting sealed assemblies that cannot tolerate particulate contamination.

AGF-ACU is specified for a temperature resistance range of -40 to 240°C and continuous operation from -20 to 220°C, with the copper layer resisting high-temperature oxidation. EMI shielding effectiveness is published as above 60 dB in the 100 MHz-1 GHz band, making the film a combined thermal and shielding layer for compact RF-adjacent designs. These are published typical figures; shielding performance in a finished product depends heavily on grounding and enclosure design, so validate at the assembly level. Confirm current values in the TDS for your lot before using them as design inputs for certification-relevant calculations.

AGF-ACU installs with conductive or double-sided adhesives, and the flexible, durable composite conforms to curved and irregular surfaces without damage. It is supplied in rolls with customizable size; total thickness can be tailored within 50-400 μm, and the copper foil gauge can be selected at 20, 30, or 50 μm to balance spreading performance, weight, and cost. Buyers can submit drawings so the factory can advise on tolerances and propose roll, sheet, or die-cut formats, and samples for pilot builds can be arranged. Where electrical contact with the copper is intended, specify the adhesive and grounding scheme during technical review.

The copper substrate is electrically and thermally conductive, so the published table lists no dielectric strength for AGF-ACU; keep the foil face clear of unintended live contacts, or add an insulating layer where isolation is required. Copper is also roughly three times denser than aluminum, so weight-critical designs should account for foil gauge selection. No UL94 flame rating is published, and volume resistivity (≥1.0×10¹³ Ω·cm) is a typical value to confirm in the current TDS. Store rolls in a dry, room-temperature environment – published shelf life is three years – and avoid surface oxidation by keeping packaging sealed until use.