AGF-API PI Film Composite Aerogel Insulation Film

AGF-API laminates an aerogel coating onto a 25 or 50 μm polyimide (PI) film substrate. Standard total thicknesses are 100±10, 200±15, and 300±15 μm, customizable across 50-400 μm. The aerogel coating is bonded to the PI film through advanced processing that prevents delamination and powder loss even under prolonged high temperatures. The aerogel layer’s thermal conductivity is 0.022-0.026 W/(m·K). The PI substrate contributes high tensile strength, tear resistance, and resistance to acid and alkali corrosion, giving the composite a durability profile suited to harsh-environment insulation rather than only consumer-device gaps.

Beyond the manufacturer-listed consumer electronics applications – wearables, smartphones, laptops, tablets, OLED displays, smart TVs, digital cameras, and e-cigarettes – AGF-API is positioned for high-temperature electrical insulation such as motor windings and high-voltage cable joints. The PI film withstands continuous temperatures up to 220°C, enabling stable composite operation well above typical polymer substrates. With a low dielectric constant of 3.5 at 1 MHz, the film provides both thermal barrier and electrical insulation functions in one layer, which is valuable in compact, heat-intensive electrical assemblies where both functions must coexist in limited space.

The specification table gives AGF-API a temperature resistance range of -40 to 260°C and a continuous operating temperature of -20 to 230°C, the highest continuous rating among the substrate-based AGF films. This is enabled by the PI substrate, which tolerates continuous exposure above 220°C where PET-based constructions cannot operate. Chemical stability – resistance to solvents and aging – supports long service in demanding environments. As always, sustained operation near the upper limit should be validated on the actual assembly, and the figures should be confirmed against the current TDS for your lot before design freeze.

Yes. The manufacturer specifically notes precision processing capabilities including laser cutting and molding, allowing AGF-API to be adapted to complex geometries for demanding insulation components. The film is flexible and cuttable, suitable for curved and bent surfaces, and is supplied in rolls with customizable size. Standard gauges are 100, 200, and 300 μm, with custom thicknesses available within 50-400 μm, and the PI substrate can be specified at 25 or 50 μm. Buyers can submit drawings so the factory can confirm achievable cutting tolerances and propose roll, sheet, or die-cut formats for the assembly process.

AGF-API carries no adhesive layer and no release liner in its standard construction, so the assembly must provide the fixing method, and the exposed aerogel face should be handled without abrasive contact. No UL94 flame rating is published for this model, so formal flammability requirements need separate discussion with the factory. Published electrical values – dielectric strength ≥4 kV/mm and volume resistivity ≥1.0×10¹³ Ω·cm – are typical figures to be confirmed in the current TDS. Storage should be in a dry, room-temperature environment, with a published shelf life of three years. PI-based construction typically costs more than PET-based alternatives, so match it to genuine high-temperature needs.